| 摘要 |
PURPOSE:To enable a good adhesive state without a hollow in a soldering material layer for adhesion by removing an inactive gas existing near and the under gap of a semiconductor substrate through an oblique hole at the time of the adhesion of the semiconductor substrate. CONSTITUTION:Plural oblique holes 7 are penetrated through a lid plate 41 around an aperture 6 and relating to each oblique hole, vacuum exhaust means 8 are provided. The oblique hole 7 is inclined to the adhesive part of a power transistor element 2. If exhausted to the direction shown by an arrow A by the exhaust means 8 at the time of adhesion, an inactive gas existing near the adhesive part is exhausted through the oblique hole 7 to the outside of a heating furnace. consequently, this exhaust function allows the adhesion of the power transistor element without leaving the inactive gas between adhesive surfaces. |
