| 摘要 |
PURPOSE:To use a conventional semiconductor production unit having extremely excellent fine workability and uniformity of a method wherein a light-receiving section for an image sensor and one part of a driving circuit are formed onto a round-shaped glass substrate by using the semiconductor production unit, required sections are cut to a rectangular shape and a plurality of these rectangular sections are bonded onto the substrate in one row. CONSTITUTION:A large number of chips 12 having a-Si light-receiving sections and one parts of a driving circuit for blocking diodes, etc. consisting of a-Si as occasion demands are formed onto a round-shaped glass substrate 11 by using a semiconductor production unit having extremely superior fine workability and uniformity. Light-receiving sections shaped onto the round- shaped glass substrate 11 are cut out at every chip. A plurality of rectangular chips are arranged in one row. Accordingly, a plurality of the light-receiving sections composed of a-Si shaped onto the round-shaped glass substrate 11 by the semiconductor production unit are disposed in one row, thus manufacturing a large one-dimensional image sensor which can be utilized for an adhesion type image sensor. |
