| 摘要 |
PURPOSE:To enable effectively preventing an erroneous judgment and collecting accurate data by forming an alignment mark so that the contact conditions of the edge of a probe can be judged at the time of an electrical measurement. CONSTITUTION:The region encircled by a dotted line is a semiconductor chip 1 wherein plural alignment marks 2 for electrical measurement are formed, the alignment mark consists of a metal piece 4 smaller than a bonding pad 3 and an insulation (SiO2) layer 5 and these are mutually connected electrically with a metal wiring 6. This enables to perfectly confirm the contact conditions of a wafer with a probe at the time of electrical measurement by an auto-prober and consequently, an erroneous measurement due to the poor contact of the probe with a pad can be previously be prevented. If a probe board is specifically used, the bending of the wear of the edge or the slipping of the probe can also be detected. |
