Semiconductor measuring instrument

摘要

The invention relates to a semiconductor measuring instrument with a sensor chip disposed in a housing, especially a silicon pressure sensor, which sensor chip via an intermediate support is disposed on a metallic or ceramic extension piece. In fabricating such semiconductor measuring instruments, the semiconductor materials must be joined to the materials of the extension piece by soldering processes. Owing to the different thermal expansion coefficients of the different materials, mechanical stresses are caused in the sensor chip upon cooling after soldering which show up as unwanted changes of the characteristics and can generally be compensated only with a major effort in terms of testing and compensation. According to the invention, the intermediate support (15, 25, 35) on its back has an annular groove (16, 26, 36) running outside the extension piece (2, 32). By virtue of this simple fabrication measure which is achieved with little effort by etching or electroerosion, the prestress of the sensor chip can be substantially reduced. In an advantageous further refinement, the intermediate support (25, 35) may additionally have a cutout (28, 38) on its side facing the sensor chip (20, 30). <IMAGE>