| 摘要 |
1322081 Electroless plating SHIPLEY CO Inc 21 April 1971 [3 June 1970] 10465/71 Heading C7F An electroless plating solution (pH 4À0 to 7À0) comprises Ni, Cu and hypophosphite ions. The Cu compound may be cupric and cuprous benzoate, acetate, bromide, carbonate, chloride, fluoride, ammonium chloride, cupric citrate, cupric nitrate, cuprous hydroxide or cupric sulphate. The Cu ion content is between 15 and 100 parts per million of solution. Examples are given of depositing on chromated steel, Al and cloth which has been treated with, ammonium hyroxide, acetic acid, and a sensitizing solution of Pd and stannic acid colloids. Several electroless solutions are described using nickel sulphate hexahydrate, with ammonium chloride or sodium acetate. The alloy formed may contain 5 to 15% of phosphorus. |
