发明名称 METHOD AND LAYER STRUCTURE FOR PRODUCING MULTILAYER PRINTED CIRCUIT BOARD
摘要 <p>In this process for making multilayer printed-circuit boards, the layer construction of laminates and prepregs is already joined before the hardening process using mechanical connecting elements, so that the laminates are fixed relative to one another, preferably by the material locking. The longitudinal construction is thus itself characterised in that it is joined using mechanical connecting elements (5) so that the laminates (1, 2) are fixed relative to one another by the connecting elements (5). <IMAGE></p>
申请公布号 JPS6169197(A) 申请公布日期 1986.04.09
申请号 JP19850134463 申请日期 1985.06.21
申请人 PUREJIDENTO ENG CORP 发明人 RAINAA BURUGAA
分类号 B32B37/00;H05K3/46 主分类号 B32B37/00
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