| 摘要 |
PURPOSE:To miniaturize device itself, and to increase density thereof by bending partial leads and residual leads in a plurality of leads in the opposite directions. CONSTITUTION:Leads 11 are connected electrically to a semiconductor chip in a package 10, and extended under the state, in which they vertically run parallel in two rows, to the outside from both side surfaces 12 of the package 10, lower leads 11 are bent downward, and upper leads 11 are bent upward in the direction opposite to the lower leads 11. Since the leads 11 are shaped in both vertical directions of the package 10, the leads 11 in the number twice as many as a DIP type can be lead out even in the package in the same size as the DIP type. The substantial area of a printed wiring board required for mounting can be reduced to half or lower in a space for wiring round wiring patterns corresponding to leads for an integrated circuit device. |
