| 摘要 |
PURPOSE:To prevent any protruded part of a resin from generating on the surface of the resin molding part by a method wherein the opening areas of the entrance parts of the punched holes for the guide pins supporting one end of the chip mounting substrate part of the lead frame in the metal mold are made larger. CONSTITUTION:When a resin molding part 8 is formed, one end part of the chip mounting substrate part 1 of the lead frame is held between guide pins 16 and 17 with stage, which respectively protrude from a top force 11 and a bottom force 12 into the interior of a cavity 10a, and a positioning of the chip mounting substrate part 1 is performed. Wide-mouthed punched foles 8c for the guide pins 16 and 17 with stage are formed in the resin molding part 8. Then a resin reservoir is formed at the entrance of each guide pin punched hole. At the same time as the time of the formation of the resin reservoirs, the total capacity of each guide pin punched hole 8c becomes larger. As a result, even though a resin for punched hole filling is injected excessively in the punched holes, the excess component stays at the wide-mouthed part of the entrance part of each hole 8c and does not stick on the surface of the resin molding part 8. When a heat-radiating plate is mounted on the lower surface of the resin molding part 8, such a possibility that the contact area of the heat-radiating plate and the resin molding part decreases is not generated. |
