发明名称 GOLD REMOVAL PROCESS
摘要 A process for removing gold from a gold-coated substrate is disclosed. The gold-coated substrate is submerged in an electrolytically conductive solution. An electrode is also placed in the solution in spaced relation with the gold coating. A potential difference is applied across the electrode and the gold coating to render the coating positive with respect to the electrode thereby causing the gold coating to be oxidized. The applied potential difference is terminated and the substrate emerged from the solution. Oxidized gold remaining on the surface of the substrate is them removed.
申请公布号 US3663388(A) 申请公布日期 1972.05.16
申请号 USD3663388 申请日期 1970.10.28
申请人 SCM CORP. 发明人 CLARENCE L. HEDMAN JR.
分类号 C25F5/00;(IPC1-7):B01K1/00;B23P1/00 主分类号 C25F5/00
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