| 摘要 |
PURPOSE:To alleviate the mounting position accuracy of a microscope on axis remarkably by a method wherein a semiconductor printing device making alignment of a wafer with a reticle utilizing an off-axis optical system is provided with a detection system in alignment marks on axis. CONSTITUTION:An alignment mark detecting system on axis enters beams emitted by a laser tube 13 into a projecting lens 2 through the intermediary of a polygon mirror 12, a half mirror 10, an objective lens 9 and another mirror 8 to scan alignment marks on a reticle 3 and a wafer 5. Any scattering light from marks may be detected by a photoelectric detector 11 through the halfmirror 10. A control circuit in a control box 14 may detect the position of marks i.e. the position deflected from regular position of wafer when a shifting stage 1 is shifted to the first exposure position. Through these procedures, any deflected position of a microscope 18 off axis due to temperature, time lapse and mounting process etc. may be measured to correct the feed of wafer to the first exposure position or later positions. |
