| 摘要 |
PURPOSE:To bond a cap easily, and to prevent a scattering into a package of a sealing member by forming the section of the cap to a U shape and forming a stepped section, in which an inner circumferential section is higher than an outer circumferential section, to a surface, with which the cap is bonded, in a package proper. CONSTITUTION:The section of a cap 2 is formed to a U shape, and a stepped section 4 in which an inner circumferential section is higher than an outer circumferential section is shaped to a surface, with which the cap 2 is bonded, in a package proper 1. Consequently, the cap 2 is positioned precisely by a form thereof and the stepped section 4 of the package proper 1. Adhesives 3 are positioned outside the stepped section 4, thus resulting in no scattering into the package proper 1 of the splashes of adhesives even when adhesives 3 melt, then damaging no semiconductor element sealed. |
