ETCHING DEPTH MEASURING APPARATUS

摘要

PURPOSE:To enable the measurement of depth during the etching, by setting a laser light oscillator above a processing chamber to irradiate the surface of work with laser light by way of a through hole piercing a half-mirror and an electrode. CONSTITUTION:In a dry etching apparatus 1 so designed that planar upper and lower electrodes 4 and 5 are arranged facing each other in a processing chamber 3 to etch work (wafer) W placed on the lower electrode 5, a laser light oscillator 11 is set above a processing chamber 3 to irradiate laser light on the work W by way of a through hole 8 piercing a half-mirror 12 and the electrode 4. Then, a reflector 13 and a laser light measuring device 14 are arranged as opposed to each other on the side of the half-mirror 12 and reflected light from the work W is introduced to the laser light measuring device 14 to measure the etching depth conducting an etching.