| 摘要 |
PURPOSE:To reduce the cost of an E (electrical) P-ROM by a method wherein the portion constituting its package is a combination of transparent and opaque resins. CONSTITUTION:An EP-ROM chip 1 is installed on a metal tab 2. A plurality of leads 3 radiates from the tab 2 and connection between the electrodes of the chip 1 and the leads 3 is estabilished by wires 4. The chip 1 and the ends, near the chip 1, of the leads 3 are molded in a transparent resin 5. The resin 5 is further accommodated in a transparent resin 6, with a portion of the resin 5 exposed so that the active region of the chip 1 may be visible. In a semiconductor deviced of this design, memory inside may be erased by projecting ultraviolet rays upon the chip 1 through the exposed transparent resin 5. This design greatly reduces the cost of materials, to be used for the product. |
