| 摘要 |
PURPOSE:To speed up the bonding operation and to favorably perform a bonding by applying the desired bonding load by a method wherein a capillary is provided being connected directly with a rotary motor. CONSTITUTION:One end of a capillary 1, wherein a bonding-wire is penetratingly inserted, is supported by a tool arm 2 and the other end of this arm 2 is directly connected with the rotating shaft 4 of a rotary motor 3. A tool lifter arm 6 is disposed in a case body 5 at the coupling part of this arm 2 and the revolution of the rotating shaft 4 is transmitted to the arm 2 through the arm 6. Moreover, the other end of the rotating shaft 4 is supported by the case body 5 through bearings 7 and a position detector 8 and a speed reducer 9 are provided adjacent to the motor 2. This case body 5 is placed on an X-Y table 10 and is made to shift to the position of the bonding pad 12 of a semiconductor chip 11. Furthermore, the capillary 1 is directly connected with the motor, an ultrasonic wave is made to generate from the arm 2 and the desired bonding load is applied to perform a bonding. By this method, the bonding operation is speeded up. |
