发明名称 BONDING
摘要 PURPOSE:To obtain stable temperature conditions at the time of wire-bonding and to connect a pellet with a lead favorably and electrically by a method wherein the heat-generating body consisting of a laser beam source is provided outside the bonding table and the electronic parts are heated. CONSTITUTION:A bonding table 1a is used as a heater block 3, wherein a cylindrical heater 2 is inserted, and a temperature sensor 4 is inserted in this block 3. The temperature of the block 3 is sensed by this sensor 4 and heating by the heater 2 and the stop thereof are controlled. A laser beam source 5a is mounted over the upper direction of the table 1a. A lead frame 7, whereon a mounting of a pellet 6 ends, is placed on the table 1a, the frame 7 and the pellet 6 are preheated by the heater 2, laser beams 9a are irradiated on the pellet 6 and the inner lead parts 8 of the frame 7 from the laser beam source 5a just before a bonding of the pellet 6 and the frame 7 is performed and the frame 7 and the pellet 6 are heated. According to this method, stable temperature conditions are obtained at the time of the bonding and the pellet 6 and the lead parts 8 are favorably connected with each other.
申请公布号 JPS6167926(A) 申请公布日期 1986.04.08
申请号 JP19840189608 申请日期 1984.09.12
申请人 HITACHI TOKYO ELECTRONICS CO LTD;HITACHI LTD 发明人 KOBAYASHI YASUO;MATSUOKA AKIRA;SAYAMA SHIGEO;TAKENO MITSUGI;SATO TAKANORI
分类号 H01L21/60 主分类号 H01L21/60
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