发明名称 SUBSTRATE AFTER-TREATMENT DEVICE
摘要 PURPOSE:To sufficiently perform a corrosion preventing treatment on the substrate, whereon the prescribed treatment is already performed, without softening and deteriorating the resist by a method wherein a gas component sticking on the substrate is evaporation-removed by a vacuum and low-temperature heating action. CONSTITUTION:A substrate 10, whereon the prescribed treatment is already performed, is delivered to a belt conveying chamber 90 from a reaction chamber 20 through a gate valve 30, is received by an arm conveying unit 93 and is conveyed to the holding part of a holding stand 62. A power source 72 is conducted, an infrared lamp 71 is made to generate heat and the substrate 10 is heated from its surface to be etched. During this time, a gas component sticking on the substrate 10 is made to evaporate from the substrate 10 by a vacuum and low-temperature heating unit 70. After that, the substrate 10 is transferred to the unit 93 from the holding stand 62 by making a table 82 ascend, and furthermore, after being delivered to a belt conveying unit 91, the substrate 10 is carried in an unloading chamber 100 by a conveying unit 92 through a gate valve 31 and is housed in a cassette 110.
申请公布号 JPS6167919(A) 申请公布日期 1986.04.08
申请号 JP19840189516 申请日期 1984.09.12
申请人 HITACHI LTD 发明人 KANAI NORIO;SHIBATA FUMIO;KAWASAKI YOSHINAO
分类号 H01L21/302;H01L21/3065;H01L21/677;(IPC1-7):H01L21/302 主分类号 H01L21/302
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