摘要 |
A tape applying device for punching an annular piece out of an adhesive tape and applying the annular piece of adhesive tape to the inner leads of a lead frame having leads which extend outwardly therefrom in four general directions includes an inner pattern punch disposed along the direction of the travel of the adhesive tape on one surface side thereof and an outer pattern punch disposed along the direction of the travel of the adhesive tape on the same side as the inner punch on the downstream side relative to the inner punch. The outer pattern punch is provided with a press mechanism for applying under pressure the annularly shaped piece of the adhesive tape to the inner leads of the lead frame.
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