| 摘要 |
PURPOSE:To suppress the deformation of a package portion and improve the moisture resistance of a semiconductor device, by providing a second tie bar for each pair of adjacent lead groups rather than connecting the second tie bar to the outer frames. CONSTITUTION:A second tie bar 21 is not connected to outer frames 16. Therefore, leads 19 are readily deformable in any of the three directions, X, Y and Z. Since a second tie bar 21 is provided for each lead group, it is possible to suppress the deformation of adjacent groups of leads 19 in opposite directions, which means that the leads 19 are deformable easily. Thus, the leads 19 can be deformed in response to the shrinkage of a resin; therefore, deformation of the leads 19 takes place in a direction in which the resin shrinks. Since the resin is apt to shrink in the X-Y direction, it is possible to inhibit the shrinkage of the resin from causing the package to be deformed in the Z-direction. |
