发明名称 METHOD FOR FORMING INSULATING COATING OF ELECTRONIC COMPONENT
摘要 PURPOSE:To obtain an electronic component having an excellent electric characteristic and capable of improving the mounting space by a method wherein an electronic component is coated with an insulating paint, then it is dipped in a liquid having a specific gravity larger than that of the paint, and it is hardened in that state thereby to form an insulating coating of a uniform thickness. CONSTITUTION:An electronic component 1 fixed to a vonveyer tape 3 is reversed in a paint bath 5, so that it is positioned under the conveyer tape 3 and dipped in an insulating paint 6. The electronic component 1 is taken out from the paint 6 by a feed roller 44 at the end of the paint bath 5, and then it is dipped again in a liquid 8 by a feed roller 45. At this state, since the insulating paint 6 adhering to the electronic component 1 has not yet hardened, it tends to sag. However, it does not sag, because a force corresponding to the difference in specific gravity between the paint 6 and the liquid 8 having a specific gravity larger than that of the paint 6 upwardly acts thereon. Therefore, the electronic component 1 is conveyed into the liquid 8 while it is being kept in the condition at the time of adhering, and the paint 6 is subjected to irradiation of ultraviolet rays at an ultraviolet ray radiation apparatus 9 so that it is hardened.
申请公布号 JPS6167206(A) 申请公布日期 1986.04.07
申请号 JP19840187268 申请日期 1984.09.08
申请人 TAIYO YUDEN CO LTD 发明人 AOSHIMA YOSHIYUKI;HARADA NOBUYUKI;TOMITA JUNICHI
分类号 H01F27/06;H01C1/02;H01C17/02;H01F27/02;H01F41/12;H01G4/224;(IPC1-7):H01F15/02 主分类号 H01F27/06
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