| 摘要 |
PURPOSE:To enlarge the application range of a hybrid integrated circuit and improve the reliability thereof, by employing a polybutadiene resin as an intermediate protection material for the hybrid integrated circuit. CONSTITUTION:An intermediate protection material 2 for a hybrid integrated circuit which serves as a buffer needs to have an appropriate adhesive force while protecting the circuit from humidity and thermal stress. The protection material 2 also needs to adhere to a sheathing material 1 such as an epoxy resin in such a manner that the required mechanical strength of the hybrid integrated circuit as a whole is maintained. A semiconductor chip 5 is pre-coated with a silicone resin 3. When a polybutadiene resin, which is excellent in moisture absorption, water permeability and hermetically sealing properties, is employed as the intermediate protection material 2, a satisfactory measure for impurities can be also taken for a high-packing density IC element which is mounted on the hybrid integrated circuit. |
