| 摘要 |
<p>PURPOSE:To increase the degree of accuracy of connection and obtain a contact- type image sensor which exhibits high resolving power and high accuracy, by connecting together a plurality of chips obtained by carrying out a step of cutting a semiconductor substrate provided with a circuit from the obverse surface thereof and a step of cutting the substrate from the reverse surface thereof by effecting selective etching. CONSTITUTION:An adhesive sheet 2 is stucked to the reverse surface of a semiconductor substrate 1 having a circuit formed thereon. The adhesive sheet 2 is provided for the purpose of completely full-cutting the substrate 1 and of protecting the stage of a dicing saw from any damage. The semiconductor substrate 1 is then set on the stage of the dicing saw, and either full-cutting or half-cutting is effected. Thereafter, a through-hole is provided in a part 4 where selective etching is carried out. The above-described procedure may be carried out in reversed order.</p> |
