LEAD WIRE CONNECTING METHOD FOR HYBRID INTEGRATED CIRCUIT

摘要

PURPOSE:To enable an aluminium lead wire to be bonded ultrasonically with simple processes and equipments, by layering a metallic foil of two-layer structure consisting of copper and nickel on a metallic substrate with the nickel on the upper side and with an insulator layer interposed between the metallic foil and the substrate, and by etching it to form a circuit conductor. CONSTITUTION:A metallic foil consisting of a copper coil 3 and a nickel foil 11 is layered on a metallic substrate 1 with the nickel foil 11 on the upper side and with an insulator layer 2 interposed between the foil and the substrate. The copper foil 3 and the nickel foil 11 are etched simultaneously to form a circuit conductor. A semiconductor chip 5 is bonded thereto with solder 4 and connected to the two-layer circuit conductor consisting of the copper foil 3 and the nickel foil 11 with an aluminium lead wire 7 by means of the ultrasonic vibration. Thus, a hybrid integrated circuit is provided.