| 摘要 |
PURPOSE:To reinforce the adhesive property of resin avoiding a lead part peeling from a resin part by means of forming rough surface between resin part and adhesive part. CONSTITUTION:Abrasive grains 4 are jetted from a nozzle 3 over flat surface of a sheet material 2 made of alloy such as nickel, copper etc. to roughen both surface and backside just like ratin finish. The abrasive grains 4 may be jetted either by means of sand blasting or liquid honing process. The sheet material 2 is stress-removed in an annealing furness to be pressed into specified shape. After bonding a semiconductor chip 5 on a lead frame 1 so far produced, a resin part 8 is formed while the lead frame 1 is sheared to be separated into each semiconductor device 9 and then leads 10 are bent downward. Through these procedures, the leads 10 may never be pelled from the resin part 8 since the resin part 8 and the lead frame 1 are solidly bonded to each other due to the satin finishing of the lead frame 1. |
