| 摘要 |
<p>PURPOSE:To obtain images of high resolution without dark current, after images, and baking out of each photosensitive substrate by a method wherein image signals are taken out by stacking a plurality of photosensitive substrates having different sensing wavelength regions and many picture elements, and by setting both sides of each photosensitivesubstrate at different temperatures. CONSTITUTION:The first photosensitive substrate 2 and the second photosensitive substrate 3 are provided on the back of a substrate 1 highly permeable to light of desired wavelength. The first and second photosensitive substrates 2 and 3 both have one-dimensional or two-dimensional picture elements having the distributions of sensitivities of required light wavelength. Here, in case of light incidence from the side of the first photosensitive substrate 2, this substrate is sensitive e.g. to visible light, and the second photosensitive substrate to infrared rays. The sides of contact with the two photosensitive substrates 2 and 3 of the substrate sensitive to the shortest wavelength region and the substrate sensitive to the shortest wavelength region and the substrate sensitive to the longest wavelength region are set at different temperatures, thus taking image signals out of each photosensitive substrate.</p> |
