| 摘要 |
PURPOSE:To effectively form fine mask patterns by a method wherein a step is formed in the periphery of the substrate surface with a grindstone having stepped patterns, and the surface is polished in mirror. CONSTITUTION:An as-sliced substrate is lapped with abrasive grains of alumina, thus flattening the surface. A stepwise difference with a required dimension is formed in the substrate periphery with a grindstone. The surface part is polished to a required thickness by mirror polishing with fine-grained alumina. Surface damage generated during mirror polishing is removed by etching the substrate wafer. Resist is applied on the substrate wafer to a required thickness and baked. |
