| 摘要 |
PURPOSE:To prevent the generation of a flaw on a wafer due to its contact with a cutter and enable the exfoliating action to be given to the wafer closely attached to the cutter, by equipping a soft attractive pad and giving torque to the wafer in a direction it is detached from the cutter. CONSTITUTION:An attractive device 1 is gradually lifted by a lifting means 2 performing a follow-up motion to a rise of an ingot (a). And the attractive device 1, at least immediately before a wafer (b) is cut off, is extruded by the action of a laterally transferring cylinder 7 in the lifting means 2 to a position adjacent to the wafer (b), simultaneously applying air attracting action. In this way, an attractive pad 31, being curved due to its weak elasticity to a side of the wafer (b) by an attractive air stream generated in a clearance even if it is slightly provided for the wafer (b), closely attaches the whole peripheral surface to the wafer (b). Next the attractive pad 31, forming a flat shape as the vacuum pressure increases in a sucker 22, advances the sucker 22 against an urging means 28. |
