| 摘要 |
PURPOSE:To enable the close attachment of a wafer to a rotary blade or the wafer to each other to be eliminated, by providing a mechanism, which attractively mounts the wafer, and an air blow pipe blowing pressure air to an opposite surface of the wafer. CONSTITUTION:An attractively holding mechanism 2 equips an attractive main unit 20 providing a mounting hole 21 connected with an air suction means and a sucker 24 setting to its point end an attractive pad 33 mounted to said main unit 20. Here the attractively holding mechanism 2, at least immediately before a wafer (b) is cut off, is extruded by the action of a lateral transfer cylinder 8 in a lifting means 4 to a position adjacent to the wafer (b) simultaneously applying air attracting action, causing the sucker 24 to be brought into contact with the wafer (b) and attractively mount the wafer (b). While a water film between the wafer (b) and a cutter C is destroyed by blowing pressure air immediately before the wafer (b) is cut off from an ingot (a). Accordingly, the wafer (b), losing closely attaching force to the cutter C, is easily detached. |
