| 摘要 |
<p>PURPOSE:To apply resist uniformly over the wafer surface by making the resist in the neighborhood of marks interfere with each other by a method wherein alignment marks are formed by making a pair of L-shaped marks opposed to each other. CONSTITUTION:Indicator marks 11 and alignment marks 4 are formed on the surface of a wafer 1. Marks 4 are produced by arranging a pair of L-shaped marks in opposition to each other. Then, at the time of applying the resist 12 by spin coating, the actute parts of marks 2 and 3 come opposed to each other, and the resist in the neighborhood of the marks 2 and 3 is interfered with each other. Thereby, the resist 12 is applied uniformly over the surface of the wafer 1.</p> |
