发明名称 DIE BONDING POSITION DETERMINING METHOD FOR LIGHT EMITTING ELEMENT
摘要 <p>PURPOSE:To accomplish high-precision positioning by a method wherein a light emitting diode is activated and light emitting regions and reference marks on a supporting member are simultaneously, directly detected and the distances between the two are determined to ensure proper positioning. CONSTITUTION:A light emitting element 2 is adsorbed by a collet 1, an electric current is applied thereto for the activation of light emitting region 5a, 5b for the emission of light, the collet 1 is driven by a driving unit 9 for the transfer of the light emitting element 2 to a location just over a die pad 8 of a supporting member 4. A pattern constituted by the optical emitting regions 5a, 5b and the reference markers 7a, 7b of the supporting member 4 is observed in a single field of vision by image pickup units 10a, 10b, and the image signals are fed into an image processing unit 11. In the image processing unit 11, the image signals are converted into digital data, the distances between the light-emitting regions 5a, 5b and reference markers 7a, 7b are determined, and then the differences are computed on the basis of a reference distance stored in a memory. Signals to complement the detected differences are supplied for a corrective movement to be effected by the driving unit 9 for the trimming of the position of the collet 1. Corrective movements are repeated for the light emitting element 2 to be precisely positioned at a prescribed point on a supporting member 4 no matter what the dimensions may be of the light emitting element 2.</p>
申请公布号 JPS6140040(A) 申请公布日期 1986.02.26
申请号 JP19840161075 申请日期 1984.07.31
申请人 OKI ELECTRIC IND CO LTD 发明人 TANABE HIROSHI;TOKURA KAZUO;TAKAHASHI YOSHIRO
分类号 H01L21/52;H01L21/60;H01L33/08;H01L33/48 主分类号 H01L21/52
代理机构 代理人
主权项
地址