| 摘要 |
PURPOSE:To surely take off a wafer, by providing a means, which releases the wafer from its close attachment to a cutter by injection of pressure air, and a means giving torque to the wafer in a direction it is detached from the cutter. CONSTITUTION:An attractively mounting mechanism 2 provides a sucker 12, in-out movably supported to an attracting main unit 10 and equipping a resilient unit 18 urging rearward, and an attracting pad 20 mounted to this sucker. While a supporting mechanism 3, supporting the attractively mounting mechanism 2, provides a lifting means 50, lifting the attractively mounting mechanism 2 with a follow-up motion to the cut rising motion of an ingot (a), and a reciprocating transfer member 31 for the attractively mounting mechanism 2 approaching to and separating from a wafer (b). While an air blow nozzle, which releases the wafer (b) from its close attachment to a cutter C by injecting air synchronously with the attracting action, is provided in the vicinity of the sucker 12 of the attractively mounting mechanism 2. |
