Solder contact promoter

摘要

The invention relates to a solder contact promoter for pretreating solder points in solder joints between alloy parts, in particular dental-alloy parts. In order to be able to make corrosion-resistant and adhesive solder joints between the alloy parts, the invention proposes applying to the solder point elemental palladium or a palladium compound which is preferably provided as a palladium powder suspension or dissolved or suspended in a solvent. The elemental palladium sinters together through exposure to heat and diffuses into the surface of the solder point of the alloy part. If the solder contact promoter contains a palladium compound, elemental palladium, which also sinters together and diffuses into the surface of the solder point of the alloy part, is released by thermal dissociation after exposure to heat. Very fine dental-alloy parts can consequently be soldered together. Anionic surfactants and/or nonionic surfactants, alkali fluorides and lithium compounds, as optional components, improve the action of the solder contact promoter.