| 摘要 |
PURPOSE:To position a linear active region positively at the center of a pellet while enabling cleavage without being disturbed by the malleability of an electrode material regardless of the thickness of a back-side electrode layer by forming a groove on the back side of a wafer in response to the active region and removing the back-side electrode layer on the line section of cleavage. CONSTITUTION:The back-side main surface of a wafer 11 is etched through chemical etching while using a photo-resist film 20 with an opening 22 as a mask to form a linear groove 23 to the back-side main surface. The photo-resist film 20 is removed, and a back electrode layer 24 is shaped onto the back of the wafer including the groove 23 by a material such as gold. Since the sections of the lines of cleavage X are removed as shown as removed sections 26 in the back-side electrode layer 24 on cleavage, the malleability of the material for the back electrode layer 24 does not obstruct the cleavage. Accordingly, the wafer can be cloven easily even when the thickness of the back-side electrode layer 24 is increased sufficiently. |
