| 摘要 |
PURPOSE:To obtain a dividing method for a light-emitting diode having high yield on a division by previously executing a scribing method for acquiring a photoemissive surface and dividing and processing other surfaces after said process. CONSTITUTION:Since an electrode 3 on a main surface is deviated to the one end surface 2 side from a center S, a photoemissive surface can be obtained by dividing a section extremely close by the electrode on the division of a water. The wafter 10 to which a P-N junction 11 and electrodes 14, 13, 13... are formed completely is stuck to a thin-film sheet 15, and scribing grooves 16, 16... for obtaining the photoemissive surface are shaped. The wafer 10 to which the scribing grooves 16, 16... are formed completely is pressed by a roller 19 and divided. Divided surfaces take a rectangular form and are shaped in a mirror surface, and broken pieces and cracks are hardly generated. Residual division is conducted in order to form light-emitting diodes to an approximately dice shape, but the division is conducted by forming kerfs 20, 20... in sufficient depth or cutting the wafer through a dicing method. |
