| 摘要 |
<p>A bonding method comprises applying to a first surface at least one component of a solventless reactive adhesive compsn. as discrete discontinuous non-linear deposits in a predetermined pattern; applying to a second surface another component of the compsn. in the same way; mating the coated surfaces so that the deposits intimately mix and react to form a continuous homogeneous film adhesive bond between the surfaces; and curing the adhesive. - A uniform cured bond is obtd. by complete mixing of the components which are applied at ambient temp. EPAB- EP--97206 B A method for adhesively bonding surfaces which includes: (a) applying to a first surface at least one component of a solventless reactive adhesive formulation as discrete discontinuous non-linear deposits in a predetermined pattern to form a coated surface; (b) applying to a second surface another component of the solventless reactive formulation as discontinuous non-linear deposits in a predetermined pattern to form a coated surface, the deposits on both the first and second surface coated in such an amt. and spacing that they maintain their dimensional stability until such time that the deposits on th first surface contact the deposits on the second surface; (c) mating the coated surfaces ont to the toehr, the deposits on the first and second surfaces intimately mixing and reacting to form a continuous homogeneous film adhesive bond between the surfaces; and (d) curinq the adhesive to form a uniform continuous bond between the surfaces. (6pp)</p> |
