| 摘要 |
PURPOSE:To enable to accurately lift up a wafer without giving a damage on the clean surface of the wafer by a method wherein a lever member to be used for pushing up of the wafer and a swinging force transfer mechanism are provided in the radial guide groove located on the outer circumference of the wafer placing region on the main surface of a wafer placing stand. CONSTITUTION:A lever member 5, to be used for pushing up of a wafer, is divided into three equal parts on the circumference of a circle and arranged on the lower surface of the outer circumference of a wafer 1, and they are buried in the radial guide groove 51 located on the surface of a susceptor 3. The upper surface of the member 5 and the upper surface of the susceptor 3 are on the same plane surface, both of them come in contact with the back side of the wafer 1, and they make a contribution to the heat equalization of the wafer 1. The wafer 1 is lifted up by pushing down the outside end of the member 5 using a swinging force transferring rod 6. |
