| 摘要 |
PURPOSE:To produce a semiconductor device with high reliability by a method wherein when a semiconductor chip is bonded on a lead frame to be resin-sealed, the surface and side of chip is coated with a buffer film to relieve the internal stress due to contraction of hardened resin on both surface and side. CONSTITUTION:A sheet of semiconductor wafer formed of multiple semiconductor chip is diced into separate chips 2 with dicing plane 9. Next the chips 2 bonded on a lead frame to be connected as specified is sealed with resin containing filler as mentioned below. In other words, a side of rounded idle chip 2 provided to relieve surface and electric field concentration thereof is coated with a buffer film 8 more elastic than sealing resin such as polyimide silicon and epoxy etc. Besides, a slot 10 in parallel with a dicing plane 9 is made near the plane 9. Finally the slot 10 may be filled with sealing resin to form the buffer film 8 on the surface before resin-sealing the whole body. |
