| 发明名称 |
UN PROCEDIMIENTO PARA CHAPAR UN SUSTRATO METALICO |
| 摘要 |
<p>A process is provided for improving the non-electrolytic nickel-plating of aluminium which has been previously treated with a barrier coating such as zinc using multiple plating baths under controlled operating conditions.</p> |
| 申请公布号 |
ES535304(D0) |
申请公布日期 |
1986.04.01 |
| 申请号 |
ES20040005353 |
申请日期 |
1984.08.21 |
| 申请人 |
ENTHONE, INCORPORATED |
发明人 |
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| 分类号 |
C23C;C23C18/54;C23C28/02;C25D;(IPC1-7):C23C28/02 |
主分类号 |
C23C |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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