发明名称 MANUFACTURE OF LEAD FRAME ATTACHED WITH HEAT SINK
摘要 <p>PURPOSE:To enable to reduce man-hour, and to miniaturize manufactured devices, by a method wherein a heat sink which is formed cutting and embosses to a metal bar with the protruded shape in section is used. CONSTITUTION:The metal bar 11 with protruded shape in section is molded beforehand by cutting or milling. Penetrating holes 11c, 11c are bored at the both end of the thick part 116 of this metal bar 11. Notchings 11e which was interconnected by cutting thin parts 11d at the same width with the diameter of the penetrating holes 11c, 11c, are provided, and embosses 11f are provided at the thin part 11d, and heat sink 12 are obtained by cutting this metal bar 11. A lead frame attached heat sink is obtained by calking and fixing a lead frame 6 to this heat sink 12 by inserting embosses 11f,11f... of the heat sink 12 to the holes of the supporting leads 6a, 6a.</p>
申请公布号 JPS6161445(A) 申请公布日期 1986.03.29
申请号 JP19840183216 申请日期 1984.08.31
申请人 NEC KANSAI LTD 发明人 YAMADA HIROSHI
分类号 H01L23/50;H01L23/433 主分类号 H01L23/50
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