发明名称 THIN PLATE MATERIAL HANDLING DEVICE
摘要 PURPOSE:To change the posture of a very thin inner layer base material and deliver same between processing and transport devices by pressing a thin plate material to the front of a facing member by a turning member to be vacuum adsorbed, separating the turning member and turning to a designated position, and then releasing the vacuum adsorption. CONSTITUTION:When the leading end of an inner layer base material 51 crosses optical sensors 5, 6, according to a detection signal, an upper fin 12 is turned to be parallel to the base material 51 by an actuator and the actuator 24 is stopped. Subsequently, when the trailing end of the base material 51 crosses the sensors 5, 6, a lower fin 11 is turned to be horizontal by an actuator 20, and simultaneously, the base material 51 is reliably vacuum adsorbed to the fin 12 by a blower 32. After the elapse of a fixed time, the fin 11 is turned to the lowermost position to stop the actuator 20, and when the fin 12 is turned to be vertical by the actuator 24, the fin is collided with a stopper 13 and stopped. According to a detection signal of a sensor 37, the transport device grips the upper end of the vertical base material 51 with a grip 52, and the blower 32 is stopped to release vacuum adsorption. Therefore, the base material 51 is kept from being damaged during transport.
申请公布号 JPS6160551(A) 申请公布日期 1986.03.28
申请号 JP19840181504 申请日期 1984.08.30
申请人 HITACHI LTD;SHIN MEIWA IND CO LTD 发明人 SHIRAHA TAKESHI;KOMATSUBARA YASUYUKI;FUJITA HITOSHI;ISHIGE KANJI
分类号 B65H5/10;B65H15/00;B65H29/44 主分类号 B65H5/10
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