LOW-THERMAL EXPANSION RESIN AND COMPOSITE MOLDING

摘要

PURPOSE:The title resin material having a coefficient of thermal expansion as low as that of an inorganic substance and excellent mechanical properties, comprising an oriented polyimide having a specified structure. CONSTITUTION:An aromatic aminodicarboxylic acid derivative is polymerized at 0-200 deg.C in a solvent such as N-methylpyrrolidone, or an aromatic diamine or an aromatic diisocyanate is reacted with an aromatic tetracarboxylic acid derivative to obtain a low-thermal expansion resin material comprising a polyimide having a chemical structure unit of an aromatic group which has at least one aromatic ring easily rotatable about the molecular axis but not flexible in other directions and is nearly linear within the region of 0+ or -40 deg. about the molecular axis and contains a region in which the polyamide molecules are uniaxially oriented at an order parameter >=0.07.