| 摘要 |
PURPOSE:To prevent brazing material particles from bonding to the back surface of a cap by not further forming a seal of a dielectric stem with a cap in a chamber for containing a semiconductor element. CONSTITUTION:In a semiconductor device having a dielectric stem 25 for surrounding a semiconductor element 21 disposed on a heat sink 28 and a transparent insulating cap 26 to a light for limiting a chamber 32 for containing the element 21, sealed on the stem 25, the seal 27 of the stem 25 with the cap 26 is not exposed with the chamber 32. For example, the stem 25 is formed on the outer periphery of the cap 26, and not exposed with the chamber 32 limited by the stem 25 and the cap 26, and not faced with the chip 21. Thus, brazing material particles are not bonded to the cap 26 in the seal, thereby completely preventing the particles from dropping on the chip 21. |
