摘要 |
PURPOSE:To wash a wafer after washing by chemicals precisely even regarding particulate dust by forming a large number of holes to a running-water control plate disposed to a lower section in a tank, thickly arranging holes in a region just under a carrier and thinly disposing holes in regions except the region just under the carrier. CONSTITUTION:An inlet 26 is formed to the lower section of a tank 22, and water is fed into the tank 22 from the direction of the arrow 29. A running- water control plate 25 is mounted to the shape of a parting plate in a lower section in the tank 22. A large number of holes 27, 28 are shaped to the running- water control plate 25. The holes 27 are arranged thickly in a region just under a carrier 21 in these holes 27, 28. The holes 28 in regions except the region just under the carrier 21 are disposed thinly. Accordingly, a large amount of water are fed through the holes 27 from the region just under the carrier 21, and a small amount of water are fed through the holes 28 from the periphery of the carrier 21. |