| 摘要 |
A structure for accurately connecting a connection pattern on a leadless chip carrier (LCC) to a connection pattern on a receiving surface by means of a connector, i.e., without resorting to solder. The structure includes a generally frame- or box-shaped support cover in which the LCC is received. The support cover is provided with resilient portions at at least two sides of the inner contour thereof in order to resiliently hold the LCC therebetween. A frame surrounds the support cover to retain the same. The support cover in which the LCC is fit is coupled in the frame and retained therein by a pressure which is exerted by a cover. |
