发明名称 PRODUCTION OF CHIP HALL ELEMENT
摘要 PURPOSE:To obtain an overlapped portion between an electrode film and a magnetic sensitive element film and to form the electrode film over the side face of a dividing groove, by changing the incidence angle of vapor deposition made between the surface of master plate and the upstream direction of metallic vapor flow in the process of vapor deposition for forming the electrode film. CONSTITUTION:Grooves 8 are half cut in a master plate 5 so as to divide it into a plurality of substrates in lattice form. A magnetic sensitive element film of InSb is formed on the main surface of the master plate 5, and then a first electrode 3a is vapor deposited thereon. A second electrode film 3b is then vapor deposited so as to cover from the surface of the substrate 1 to the side face of the groove 8. A first protective film of Al2O3 is provided for protecting the joining area between the magnetic sensitive element film and the electrode films, and the magnetic sensitive element film. A second protective film of resin is deposited on the first protective film. Thus, provided is a two- layer protective film 4 consisting of the lower alumina layer and of the upper resin layer covering the joining area between the magnetic sensitive element film and the electrode films and the magnetic sensitive element film. After that, the substrate is scribed and solder is dipped on the electrode films.
申请公布号 JPS6159786(A) 申请公布日期 1986.03.27
申请号 JP19840181502 申请日期 1984.08.30
申请人 PIONEER ELECTRONIC CORP 发明人 KONUMA MASANORI;SUNAGA REIZOU
分类号 H01L43/14;(IPC1-7):H01L43/14 主分类号 H01L43/14
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