| 摘要 |
<p>An improved photolithographic process for manufacturing an electrical device, such as an integrated circuit device, which comprises coating a material (30) with a positive photosensitive coating layer (40) containing an unbleachable absorbing agent such as a dye capable of absorbing electromagnetic radiation of predetermined wavelength. The dye is used in an amount sufficient to absorb enough radiation to prevent any substantial reflection back through the photosensitive coating layer (40) of radiation initially passing through the layer from an external radiation source to the material (30) beneath said photosensitive coating layer (40). The photosensitive coating layer (40) is exposed to a light image to pattern said photosensitive layer (40) and then developed to selectively remove portions of said photosensitive coating (40) whereby the substantial absence of reflected light will permit the formation of a sharply defined image conforming to the selective light pattern transmitted to the photosensitive coating (40).</p> |
