| 摘要 |
PURPOSE:To make it feasible to bend leads doing no damage to the surface thereof by a method wherein leads projecting from a resin part protecting a semiconductor element are bent downward to be formed b y means of water jet stream. CONSTITUTION:a resin part 5 of semiconductor device 6 is contained in a hollow coatining part 9 formed by supporting jigs 7, 8 while leads 10 partly projecting outward are held by the jigs 7, 8. Next a pair of nozzles 11 rapidly jet water upon the leads 10 projecting from the jigs 7, 8 to feed the leads 10 relatively in the perpendicular direction to the surface. At this time, the leads 10 hit by the rapid jet stream is bent downward along the sides of jig 8 to produce the semiconductor device with leads accurately bent into specified shape. Through these procedures, the leads 10 may be bent rapidly with high precision suffering no damage at all compared with conventional bending process by a bender. |
