发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To prevent the oxidation of a wire by a method wherein a base metal wire is passed through a capillary through the intermediary of a clamper, and when a ball is formed at he tip of the wire by discharging electricity, the travelling path of the wire is surrounded by a duct, and inert gas or reducing gas is blown against the travelling path of the wire. CONSTITUTION:A copper wire 2 is delivered from a wire spool 1, the position of the wire is set by a delivery wire guide 3, and the wire 2 is passed through the center hole of the capillary 6 provided at the tip of a bonding arm 13 while the wire 2 is being pinched by the first and the second clampers 4 and 5. Then, a torch stick 7 is brought close to the tip of the wire 2 protruding from the capillary 6, an electric discharge is generated between the tip of the wire 2 and the torch stick 7, and the wire 2 is connected to the electrode of an IC element 9 through the intermedialy of the lead frame 10 placed on the work stage 11 containing a heater 12 using the obtained ball 8. According to this constitution, a duct 15 having a T-shaped cross-section is provided between the clamper 5 and the arm 13 surrounding the travelling path of the wire, inert gas or reducing gas is fed into a gas flow-in hole 16, and the ball 8 is surrounded by the gas.
申请公布号 JPS6158246(A) 申请公布日期 1986.03.25
申请号 JP19840179240 申请日期 1984.08.30
申请人 TOSHIBA CORP 发明人 ATSUMI KOICHIRO
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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