| 摘要 |
PURPOSE:To simplify and facilitate the bonding work of internal connection by a method wherein a semiconductor chip substrate mounted on the side sur face of a member errecting on a package substrate is connected to lead-out terminals by wiring via bonding pads provided in conduction each to the side surface and the upper surface of the member. CONSTITUTION:The mounting member 6 is equipped with the bonding pads 6a and 6b which are made of an insulating material excellent in thermal conductivity such as beryllia ceramic in order to dissipate the heat of a LED4a and extended from the side surface where the LED4a is mounted to the upper surface. The LED4a is mounted to the bonding pad 6a by bonding on the side surface of the mounting member 6, and the surface electrode of the LED4a is connected to the bonding pad 6b by bonding pad 6b by bonding with a wire 5c. The bonding pads 6a and 6b on the upper surface are connected to the terminals 2b and 2a by bonding with wires 5d and 5e, respectively. The bonding of the LED4a and the wire 5c is carried out before the mounting member 6 is fixed to the substrate 1 in these bondings. |
