发明名称 |
CIRCUIT BOAD WIRING STRUCTURE |
摘要 |
A configuration is disclosed for attaching leads (15) from several chips (1a-1d) to bus (5a) lines (9a-9m) on a printed circuit board (6). The bus (5a) includes pads (13), each directed toward one of pads (3) on the chip to be connected by arched wires (15). Lines (9a-9l) connected to each end of the board pads (13) and extend generally parallel to the chips (1a-1d) past the sections containing the pads (3). Lines (9a-9l) are displaced alternately toward and away from the chips (1a-1d) at sections containing pads (13) directed toward the chips (1a-1d) or having a part (17) taking a corresponding direction. The pads (13) alternate on opposite sides of each chip (1) to minimize the length of the leads (15) and to allow a central chip pad (3V) for carrying operating voltage (or ground) to connect to the outermost line (9m). This reduces the board space used for a bus (5a) and minimizes the length of wires (15) connecting chips (1a-1d) to a bus (5a). |
申请公布号 |
JPS6156440(A) |
申请公布日期 |
1986.03.22 |
申请号 |
JP19850179576 |
申请日期 |
1985.08.16 |
申请人 |
INTERNATL BUSINESS MACH CORP |
发明人 |
JIYON CHIYAARUZU EDOWAAZU |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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