| 摘要 |
PURPOSE:To prevent the dislocation of a bonding coupled division by bonding both ends of a head chip and cover glass with solder capable of junction to an inorganic material, bonding the center with a bonding material, and bonding the head chip to a frame with that solder. CONSTITUTION:The head chip 14 is obtained from individual cutting of a chip formed on a wafer. When the head chip 14 for which grooves 15 are provided at both ends outside a magnetic element and cover glass 5 are bonded, the both ends divisions (a) and (b) are bonded by the special solder and other division C is bonded by a traditional transparent epoxy resin. At the time when the bonding is performed, the grooves 15 prevent the melted special solder from leaking to the center of the cover glass. Using another special solder (having lower fusing point than the special solder above mentioned), the formed head chip 14 is melted to a frame 2' for coupling to obtain a lead head 2. |
